@Article{JCM-21-5,
author = {Wei-Zhong, Dai and Raja, Nassar},
title = {An Unconditionally Stable Hybrid FE-FD Scheme for Solving a 3-D Heat Transport Equation in a Cylindrical Thin Film with Sub-Microscale Thickness},
journal = {Journal of Computational Mathematics},
year = {2003},
volume = {21},
number = {5},
pages = {555--568},
abstract = {<p style="text-align: justify;">Heat transport at the microscale is of vital importace in microtechnology applications. The heat transport equation is different from the traditional heat transport equation since a second order derivative of temperature with respect to time and a third-order mixed derivative of temperature with respect to space and time are introduced. In this study, we develop a hybrid finite element-finite difference (FE-FD) scheme with two levels in time for the three dimensional heat transport equation in a cylindrical thin film with sub-microscale thickness. It is shown that the scheme is unconditionally stable. The scheme is then employed to obtain the temperature rise in a sub-microscale cylindrical gold film. The method can be applied to obtain the temperature rise in any thin films with sub-microscale thickness, where the geometry in the planar direction is arbitrary.</p>},
issn = {1991-7139},
doi = {https://doi.org/2003-JCM-8887},
url = {https://global-sci.com/article/85350/an-unconditionally-stable-hybrid-fe-fd-scheme-for-solving-a-3-d-heat-transport-equation-in-a-cylindrical-thin-film-with-sub-microscale-thickness}
}