Feature-Scale Simulations of Particulate Slurry Flows in Chemical Mechanical Polishing by Smoothed Particle Hydrodynamics
Year: 2014
Author: Dong Wang, Sihong Shao, Changhao Yan, Wei Cai, Xuan Zeng
Communications in Computational Physics, Vol. 16 (2014), Iss. 5 : pp. 1389–1418
Abstract
In this paper, the mechanisms of material removal in chemical mechanical polishing (CMP) processes are investigated in detail by the smoothed particle hydrodynamics (SPH) method. The feature-scale behaviours of slurry flow, rough pad, wafer defects, moving solid boundaries, slurry-abrasive interactions, and abrasive collisions are modelled and simulated. Compared with previous work on CMP simulations, our simulations incorporate more realistic physical aspects of the CMP process, especially the effect of abrasive concentration in the slurry flows. The preliminary results on slurry flow in CMP provide microscopic insights on the experimental data of the relation between the removal rate and abrasive concentration and demonstrate that SPH is a suitable method for the research of CMP processes.
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Journal Article Details
Publisher Name: Global Science Press
Language: English
DOI: https://doi.org/10.4208/cicp.261213.030614a
Communications in Computational Physics, Vol. 16 (2014), Iss. 5 : pp. 1389–1418
Published online: 2014-01
AMS Subject Headings: Global Science Press
Copyright: COPYRIGHT: © Global Science Press
Pages: 30
Author Details
Dong Wang Email
Sihong Shao Email
Changhao Yan Email
Wei Cai Email
Xuan Zeng Email
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Efficient Implementation of Smoothed Particle Hydrodynamics (SPH) with Plane Sweep Algorithm
Wang, Dong
Zhou, Yisong
Shao, Sihong
Communications in Computational Physics, Vol. 19 (2016), Iss. 3 P.770
https://doi.org/10.4208/cicp.010415.110915a [Citations: 4]